Deposition Magnetron Sputtering Vacuum Coating Machine/Multi-Arc Ion Sputtering Vacuum Chamber

1. Core Working Principle

1. Establishment of Vacuum Environment: A vacuum pump set is used to reduce the pressure inside the coating chamber to a high vacuum state (usually ≤10⁻³Pa), preventing air molecules from interfering with film deposition.

2. Plasma Excitation: An inert gas (such as argon) is introduced into the chamber, and a high-voltage electric field is applied between the target (coating material, e.g., aluminum, titanium, ITO) and the substrate to ionize the argon gas and generate plasma.

3. Magnetron Sputtering Deposition: A magnetic field is used to constrain the electron movement trajectory, enhancing the collision efficiency between electrons and argon molecules. This causes argon ions to bombard the target surface at high speed; the target atoms are "sputtered out", move in a straight line, and deposit on the substrate surface to form a uniform film.

2. Core Advantages

• High Film Quality: The film has good uniformity (deviation can be controlled within ±5%) and strong adhesion to the substrate, making it less likely to peel off or crack.

• High Coating Efficiency: The design of using a magnetic field to constrain electrons significantly improves the sputtering rate. The single-target deposition rate can reach 0.1-10μm/min, suitable for mass production.

• Wide Material Adaptability: The applicable coating materials include metals (aluminum, copper, silver), alloys (stainless steel, titanium alloy), and compounds (ITO, SiO₂, Al₂O₃), meeting different functional requirements.

• Environmental Friendliness and No Pollution: The entire process has no discharge of chemical waste liquid or harmful gases, and only uses inert gases and solid targets, complying with modern industrial environmental protection standards.

3. Main Application Fields

4. Key Technical Parameters (Reference)

• Vacuum Degree: Ultimate vacuum ≤5×10⁻⁵Pa, working vacuum 1×10⁻³ - 5×10⁻¹Pa
• Target Configuration: Single-target, double-target, or multi-target (supporting DC, RF, and mid-frequency sputtering), target size Φ50-300mm
• Substrate Size: Customizable; conventional sizes cover sheet materials (100×100mm - 1000×1000mm) and coiled materials (width ≤1600mm)
• Deposition Rate: 0.5-10μm/min for metal films, 0.1-2μm/min for oxide films
• Substrate Heating Temperature: Room temperature - 500℃ (precise temperature control available, temperature difference ±2℃)