| Parameter Category | Details |
|---|---|
| Substrate Capacity | Max size: Up to 6-inch (150mm); Compatible with 2"/4"/6" wafers/optical components; Min size: 10×10mm |
| Vacuum Performance | Ultimate vacuum: ≤ 1×10⁻⁶ Torr (1.3×10⁻⁴ Pa); Pumping time: minutes to 5×10⁻⁶ Torr; Leak rate: 10⁻³ Pa*L/s (He leak test) |
| Evaporation System | Electron beam power: 250W-10kW; Number of crucibles/pockets: 4-8; Supports rod (max φ4mm) & crucible (1-15cc) feedstock |
| Process Control | Substrate temperature: RT-500℃ (±1℃ precision); Rotation speed: 2-20 rpm; Film thickness monitor: QCM (0.01 nm/s resolution) |
| Film Quality | Uniformity: ±1%-±3%; Adhesion: Meets ASTM D3359 4B standard; Deposition rate: 0.1-10 nm/s |
| Compatibility | Materials: Au, Ag, Pt, W, SiO₂, TiO₂, MgF₂, YF₃, ZrO₂ (supports AR/AF/reflective films) |
| Physical Dimensions | Footprint: 1-3.3×3.0m; Height: 2.5-3.5m; Weight: <800kg (desktop/tabletop models) |
| Power Supply | Single/Three-phase: 220V/380V, 50/60Hz; Power consumption: 1.2kW-10kW |
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