Magnetic Control Winding Coating Equipment / Magnetron Roll To Roll Coating Machine

1. Core Working Principle

The equipment completes coating through the collaborative mechanism of "magnetron sputtering + continuous winding", which mainly consists of two steps:

1. Magnetron sputtering process: In a vacuum chamber, the magnetic field restricts the movement of electrons, ionizing inert gases such as argon to generate plasma. The plasma bombards target materials (such as metals, alloys, or compounds), sputtering out atoms/ions of the target material to form coating particles.

2. Continuous winding process: The substrate (e.g., PET film, copper foil) is continuously transported through the sputtering area at a stable speed via an unwinding and guide roller transmission system. The sputtered particles are deposited on the substrate surface, and finally, the finished product is collected through the winding system, realizing continuous "one-roll-through" production.

2. Core Product Advantages

1. Excellent coating quality: Magnetron sputtering technology can precisely control the coating thickness (with a tolerance usually ≤ ±5%). The coating has high density and strong adhesion (capable of passing cross-cut tests) as well as uniform composition, which can meet high functional requirements (such as high barrier properties and high conductivity).

2. High production efficiency: Adopting a continuous winding design, it does not require frequent start-stop operations. A single roll of substrate can be hundreds to thousands of meters long, and the production speed is adjustable (generally 0.5-5 m/min), making it suitable for large-scale mass production.

3. Wide material compatibility:
◦ Substrate compatibility: It can process flexible materials such as plastic films (PET, PP), metal foils (aluminum foil, copper foil), and fabrics.
◦ Target material compatibility: It supports various target materials including metals (aluminum, copper, silver), alloys (stainless steel, titanium alloy), and compounds (ITO, SiO₂), and can prepare conductive films, barrier films, decorative films, and other functional coatings.

3. Typical Application Scenarios

The equipment is widely used in industries that require surface functions for substrates, with core scenarios including:

• Packaging industry: Coating aluminum or SiO₂ on the surface of plastic films to prepare high-barrier films, which are used for food and pharmaceutical packaging (to block oxygen and moisture and extend the shelf life).

• Electronics industry: Coating copper, silver, or ITO on the surface of flexible substrates to prepare flexible conductive films, which are used in flexible printed circuits (FPC), touch screens, and electronic tags.

• New energy industry: Coating the surface of battery tabs and separators to improve the conductivity of electrodes or the high-temperature resistance of separators, which are used in lithium batteries and fuel cells.

• Decoration industry: Coating metal films (such as chromium and nickel) on the surface of films or fabrics to prepare metal-like decorative materials, which are used in furniture and automotive interiors.

4. Key Technical Parameters

5. Equipment Composition (Core Components)

A complete set of equipment usually includes five systems to ensure stable operation:

1. Vacuum System: Composed of a vacuum pump set (molecular pump, roots pump) and a vacuum chamber, it maintains the high-vacuum environment required for sputtering.

2. Magnetron Sputtering System: Includes magnetron targets (planar targets, cylindrical targets) and sputtering power supplies (DC, RF), which are responsible for generating coating particles.

3. Winding and Transmission System: Consists of an unwinder, winder, guide rollers, and tension control system, ensuring stable and continuous transmission of the substrate.

4. Temperature Control System: Equipped with chamber heating/cooling devices and substrate temperature control modules to prevent substrate deformation due to high temperatures.

5. Control System: Adopts PLC + touch screen to realize automatic control and monitoring of parameters such as vacuum degree, sputtering power, and transmission speed.