After the raw glass sheets are cleaned and dried, they are sent into the inlet transition chamber by the transmission roller conveyor. The transition chamber is first evacuated to a low vacuum (10⁻¹Pa), and then gradually increased to a high vacuum to prevent the atmosphere from entering the coating chamber and polluting the environment.
Plasma excitation: Argon (Ar) is introduced into the coating chamber, and a 400-600V DC voltage is applied between the target material and the glass (anode). Under the action of the electric field, electrons strike the argon molecules, causing them to ionize and form plasma (argon ions + electrons).
Magnetic confinement enhanced ionization: The magnetic field behind the target material forms a "magnetic trap", and electrons move in a spiral under the action of the Lorentz force, significantly increasing the collision probability with argon molecules. The plasma density increases by 10 to 100 times, improving the sputtering efficiency.
Multilayer film deposition Argon ions bombshell the surface of the target material at high speed, causing the atoms/molecules of the target material to escape and pass through each target area uniformly with the glass. They successively deposit the medium layer (SiO₂/Si₃N₄), the metal barrier layer (NiCr), the silver layer (low-emissivity core), the metal barrier layer (NiCr), and the medium protective layer (Si₃N₄), forming a complete Low-E film system. Among them, the silver layer can reflect far-infrared thermal radiation, achieving a low-radiation function. The medium layer regulates the visible light transmittance, taking into account both energy conservation and lighting.
The coated glass enters the exit transition chamber and gradually returns to atmospheric pressure. After cooling, inspection and cutting, it becomes qualified Low-E glass products.
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