Annular electron beam electron beam evaporation coating machine customize for customer needs

I. Structural Composition Annular electron beam system: annular filament (cathode), anode, focusing coil, deflection coil; The annular cathode emits hot electrons, which are accelerated by the electric field and focused and deflector by the magnetic field, precisely bombarding the material inside the crucible. Vacuum system: vacuum chamber, mechanical pump, molecular pump/cryogenic pump. The ultimate vacuum usually reaches 10⁻⁴ to 10⁻⁶ Pa, reducing gas-phase collision and contamination. Evaporation source and crucible: Water-cooled copper crucible to prevent evaporation and reaction of crucible materials and enhance the purity of the film layer; It supports multi-station switching and multi-layer film deposition. Substrate stage: It can be heated/cooled by water, and can rotate around the sun/on its own axis to ensure uniform film thickness. Control system: High-voltage power supply, beam control, film thickness monitoring (crystal oscillator), vacuum gauge and automation program, achieving closed-loop control of parameters. Ii. Working Principle Electron beam generation and acceleration: When a toroidal filament is electrified, it emits hot electrons, which are accelerated by a 5-10 kV high-voltage electric field to achieve high energy. Focusing and deflection: The electromagnetic coil focuses and deflates the electron beam onto the surface of the target material inside the crucible, with an energy density that can reach 10⁶ to 10⁷ W/cm². Evaporation and deposition: The kinetic energy of the electron beam is converted into thermal energy, and the target material rapidly heats up to the evaporation point and vaporizes. Gas-phase atoms/molecules are transported in a straight line to the substrate under high vacuum and condense to form a uniform film. Process control: Real-time monitoring of deposition rate and film thickness, dynamic adjustment of beam current and power to ensure process stability. Iii. Core Features High energy density: The local temperature can reach 3000-6000℃, and it can evaporate high-melting-point materials such as tungsten, molybdenum and SiO₂. Extremely low pollution: Water-cooled crucibles reduce crucible pollution, and the purity of the film layer can reach over 99.99%. Efficiency and rate: High thermal efficiency, deposition rate 0.1-100 nm/s, balancing efficiency and film quality. Flexible process: Multi-crucible switching supports multi-layer films. Substrate heating/rotation enhances the compactness and adhesion of the film layer. Iv. Advantages Wide material adaptability: Compatible with metals, alloys, oxides, semiconductors, etc., especially suitable for refractory materials. The film layer quality is excellent: high purity, good density and strong adhesion, meeting the requirements of high-precision optical and electronic devices. Cost-effectiveness: High material utilization rate, energy consumption concentrated on target materials, and lower long-term operating costs. High degree of automation: Parameters are precisely controllable with good repeatability, making it suitable for both scientific research and mass production. V. Typical Applications Optical films: anti-reflection films (AR), high-reflection films, filters, beam splitters, used in glasses, cameras, laser devices, photovoltaic cells. Semiconductors and Microelectronics: Metal electrodes (Al, Cu), dielectric layers (SiO₂, Si₃N₄), sensor films. Functional coatings: decorative films, conductive films (ITO), corrosion-resistant/wear-resistant coatings, applied in aerospace, tools and consumer electronics. Scientific research and small-scale production: Material preparation for universities and research institutes, as well as customized films for MEMS, biomedical devices, etc.