| Component | Specification |
|---|---|
| Vacuum Chamber | φ800×H900mm |
| Heating Method | Top, Side, Bottom (optional) |
| High Vacuum System | Molecular Pump, Diffusion Pump, Cryogenic Pump (Optional) |
| Low Vacuum System | Dry Pump, Direct Pump, Roots Pump, Rotary Vane Pump (optional) |
| Control System | Industrial Computer Touch Screen Fully Automatic Control |
| Crystal Film Thickness Monitor | Inficon XTC-3, SQC310, Shanghai MXC-3B |
| Ion Source | RF Ion Source, Hall Ion Source, Kaufman Ion Source, Hollow Cathode Ion Source (optional) |
| Rotation of Workpiece | Umbrella Workpiece Holder, Roller Workpiece Holder (optional) |
| Electron Gun | Single, Double, Multi-position (optional) |
| Cryogenic Unit | Multiple Suppliers (optional) |
| Probe System | Single, 6-point and 12-point Rotary Sensor (optional) |
| Ultimate Pressure | ≤8.0×10⁻⁵Pa (clean vacuum chamber at normal temperature, free of sample and coating material) |
| Vapor Barrier System | Unit Block, Two-position Block and Multi-position Rotary Block (optional) |
| Vacuum Pressure Maintaining | Close high valve, vacuum degree ≤9×10⁻²Pa after 1 hour |
| Required Power Supply | Three-phase Electricity, 380V, 50HZ |
| Water Pressure Required | 0.3-0.4Mpa |
| Equipment Weight | 3T-4T |
| Air Pressure Required | 0.6-0.8Mpa |
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