Advanced coating system utilizing magnetic field constraints to enhance plasma bombardment and ensure superior film uniformity across various substrate materials.
Technology Overview
RF magnetron sputtering coating equipment employs magnetron sputtering technology with RF power supply (typically 13.56MHz). The system ionizes inert gases such as argon through radio frequency electric fields to generate plasma. Under magnetic field constraints, the plasma bombards the target material surface, causing atoms or molecules to escape and deposit uniformly onto substrate surfaces.
Key Features
Exceptional material adaptability - capable of sputtering conductors, semiconductors, and insulators without requiring conductive treatment
Gentle coating process with low substrate temperature minimizes damage to heat-sensitive substrates including plastics and polymers
Precise film control through adjustable parameters including power, pressure, and time for accurate thickness, composition, and structure management
Performance Advantages
Superior film quality with high density, low defect rates, and excellent substrate adhesion
Stable sputtering rates and high production efficiency suitable for industrial batch processing
Environmentally friendly operation using only inert gases without chemical reagents, meeting green production standards
Industrial Applications
Electronics & Semiconductors
Electrode and insulating films for semiconductor chips, integrated circuits, and display panels
Optical Systems
Anti-reflection, reflective, and filter films for lenses, optical instruments, and photovoltaic modules
Industrial & Decorative
Wear-resistant, corrosion-resistant, and decorative coatings for cutting tools, molds, hardware components, and architectural glass
New Energy Technologies
Lithium battery electrode films, fuel cell catalyst layers, and solar cell coatings