High Deposition Rate: The magnetic field increases plasma density, leading to faster sputtering—solving the low efficiency problem of traditional "diode sputtering."
Superior Film Quality: Films have high density, good adhesion to substrates, and excellent uniformity.
Broad Material Compatibility: Works with almost all materials, including metals, alloys, semiconductors, insulators , and even high-melting-point materials.
Precise Process Control: Film thickness, composition, and microstructure can be adjusted by tuning parameters like power, gas flow, pressure, and substrate temperature.
Low Contamination: The vacuum environment and physical deposition process minimize chemical impurities in the film—critical for semiconductor and optical applications.
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vacuum System:Includes a mechanical pump, turbomolecular pump, and vacuum gauge. Maintains high vacuum to prevent film contamination.
Target Assembly:Consists of the target and a magnetic assembly to generate the magnetic field.
Power Supply:Provides energy for plasma generation.
Common types: DC, RF, and pulsed DC.
Substrate Holder:Fixes and heats/cools the substrate. May include a rotation function to improve film uniformity.
Gas Control System:Uses mass flow controllers to precisely regulate the flow rate of inert gases or reactive gases.
Film Thickness Monitor:In-situ monitors track film thickness in real time to ensure process accuracy.
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